Kub Muag USB 2.0 khoov taw 3 txheej chaw nres nkoj Poj niam lub rooj nrog shrapnel

Lus piav qhia luv luv:

Khoom piav qhia

Khoom npe: USB 2.0 khoov taw 3 txheej chaw nres nkoj

Kev ntsuas hluav taws xob: DC 30V 0.2A

Rwb thaiv tsev: ≥1000mΩ min.500V DC fais fab mov

Dielectric zog: 250V AC rau 1 min

Tiv tauj tsis kam: ≤50mΩ

Insertion quab yuam: ≤35N

Extraction quab yuam: ≥10N

Kev siv:

-Mainly siv nyob rau hauv high-end industries, xws li cov koob yees duab interface cov khoom, computer accessories, electronics cov khoom ua si, mobile them interface thiab lwm yam khoom yuav tsum tau them.

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Product Detail

Khoom cim npe

Cov khoom lag luam zoo: xa khoom sai, kuaj dawb, cov khoom lag luam nrog RoHS ntawv pov thawj, txheej txheem laser soldering, lub neej voj voog ntau dua 300,000 zaug, lav kev pabcuam tomqab muag, kev txhawb nqa thiab kev pabcuam zoo
Daim ntawv thov teb: Computer USB chaw nres nkoj sab nraud, cov khoom siv them nyiaj, cov cuab yeej thiab cov khoom siv, cov khoom siv hluav taws xob, cov khoom siv hauv tsev, cov khoom ruaj ntseg
Lub Hoobkas muaj zog: nrog 13 xyoo ntawm kev lag luam kev lag luam, lub tuam txhab tau dhau ISO9001 ntawv pov thawj, ntau daim ntawv pov thawj patent, ntau tshaj 5300 tus neeg koom tes, ntau cov neeg siv khoom ntawm cov tuam txhab teev npe, 106 tus neeg ua haujlwm, 12 kho vajtse punches, 18 txhaj tshuaj molding tshuab, 26 puv- tsis siv neeg sib dhos tshuab, 32 lub tshuab kuaj tsis siv neeg puv, 21 semi-automatic xeem tshuab, 12 lub neej sim tshuab thiab 25 lwm yam khoom siv kuaj.
CEEB TOOM:
1. KHOOM:
1.1 Housing: PA6T + 30% G/F, COLOR: DUB, UL94V-0;
1.2 COV NTAUB NTAWV: PHOSPHOR BRONZE
1.3 Plhaub: Phosphor Bronze lossis SK7
1.4 ISOLated: Phosphor Bronze lossis SK7
1.5 Pem Hauv Ntej Plhaub: SPCC
2. UA TSAUG:
2.1 KEV KAWM:
Kub (Saib cov lus) PLATING NTAWM CHAW UA HAUJ LWM.
100 u" MIN.BRIGHT-TIN PLATING RAU SOLDER TAIL
AREA, 50u" MIN.NICKEL UNDERPLATING Zuag qhia tag nrho,
2.2 TSI:
100 u" MIN.NICKEL UNDERPLATNG.
2.3 ISOLated: plhaub: 100u" MIN.NICKEL Plated
2.4 Pem Hauv Ntej Plhaub: 100u" MIN.NICKEL Plated.
3. ELECTRICAL CHARACTERISTIS:
Tam sim no RATING: 0.5Amper siab tshaj plaws
Hwj chim: 30V AC.
Kev tiv thaiv kev tiv thaiv: FORCE: 0.7KGF yam tsawg kawg nkaus
TSIS TXAUS SIAB: 30 MILLIOHMS MAXIMUM.
INSULATION RESISTANCE: I000MEGOHMS MINIMUM.
DIELECTRIC WITHSTANDING VOLTAGE: 750V AC ntawm SEELEVEL.
Kev ua haujlwm kub: -55 ℃ ~ 85 ℃.
STANDARD ATMOSPHEIC CONDITIONS: TSEEM CEEB TAM SIM NO TSEEM CEEB TSHAJ PLAWS NTAWM ATMOSPHEIC CONDITIONS UAS YUAV TSUM TAU TXAIS KEV PAB CUAM THIAB KEV KAWM NTAWV yog raws li nram no:
(1) SIB NTAUB NTAWV CEEB TOOM: 5ºC txog 35 ℃
(2) NTAUB NTAWV TSIS TXAUS SIAB: 45% txog 85%
(3) Kev kub siab: 86Kpa txog 106Kpa
SOLDERA BILITY TEST: Sab saum toj ntawm lub terminals yuav tsum tau dipped 1 hli nyob rau hauv lub SOLDER da dej ntawm 250 ± 5 ℃ rau 5 ± 0.5 vib nas this
RESISTANCE TO SOLDERING HEAT TEST:
REFLOW SOLDERING CONDITIONS:
PREHEAT: Kub ntawm cov tooj liab FOIL Surface yuav tsum ncav cuag 180 .120 ℃ S tom qab lub PCB nkag mus rau hauv cov khoom siv Soldering.
TALLEST TEMPERATURE: Kub ntawm qhov tooj liab FOIL Surface yuav tsum ncav cuag qhov siab tshaj plaws kub ntawm 260 ± 5 nrog rau hauv 20 vib nas this.℃
SOLDERING IRON METHOD: IB TUG MENYUAM 330 ± 5 ℃ APPLICATION SIJHAWM SOLDERING IRON 3 ± 0.5 SEC Txawm li cas los xij, kev kub siab tshaj yuav tsis siv rau lub terminal