Kub Muag USB 90 degree interface plug connector 19.5MM hlau USB AF sab plug poj niam puag USB SMT ncaj connector rau laptop
Cov khoom lag luam zoo: xa khoom sai, kuaj dawb, cov khoom lag luam nrog RoHS ntawv pov thawj, txheej txheem laser soldering, lub neej voj voog ntau dua 300,000 zaug, lav kev pabcuam tomqab muag, kev txhawb nqa thiab kev pabcuam zoo
Daim ntawv thov teb: Computer USB chaw nres nkoj sab nraud, cov khoom siv them nyiaj, cov cuab yeej thiab cov khoom siv, cov khoom siv hluav taws xob, cov khoom siv hauv tsev, cov khoom ruaj ntseg
Lub Hoobkas muaj zog: nrog 13 xyoo ntawm kev lag luam kev lag luam, lub tuam txhab tau dhau ISO9001 ntawv pov thawj, ntau daim ntawv pov thawj patent, ntau tshaj 5300 tus neeg koom tes, ntau cov neeg siv khoom ntawm cov tuam txhab teev npe, 106 tus neeg ua haujlwm, 12 kho vajtse punches, 18 txhaj tshuaj molding tshuab, 26 puv- tsis siv neeg sib dhos tshuab, 32 lub tshuab kuaj tsis siv neeg puv, 21 semi-automatic xeem tshuab, 12 lub neej sim tshuab thiab 25 lwm yam khoom siv kuaj.
CEEB TOOM:
1. Khoom Specification:
1) Rwb thaiv tsev ntaub ntawv thermoplastic.
2) Plhaub: tooj liab alloy / SPCC, T: 0.30mm
PLATING: NICKEL
3) TERMINAL: tooj liab alloy, T: 0.25mm
PLATING: Kub / TIN PLated.
2. Hluav taws xob CHARACTERISTIC:
1) Rwb thaiv tsev tiv thaiv: 100MΩ MIN.
2) Kev tiv thaiv kev tiv thaiv: 30mΩ MAX.
3) WITHSTANDING VOLTAGE: 500V AC.
3.MECHANICAL CHARACTERISTICS:
1) INSERTION FORCE: 3.57Kgf MAX.
2) EXTRACTION FORCE: 1.02Kgf MIN.
TXOJ CAI TSHIAB
Cia ib puag ncig: chav tsev kub ib puag ncig qhuav, tsis txhob sib cuag nrog cov kua qaub thiab av noo
STANDARD ATMOSPHEIC CONDITIONS: TSEEM CEEB TAM SIM NO TSEEM CEEB TSHAJ PLAWS NTAWM ATMOSPHEIC CONDITIONS UAS YUAV TSUM TAU TXAIS KEV PAB CUAM THIAB KEV KAWM NTAWV yog raws li nram no:
(1) SIB NTAUB NTAWV CEEB TOOM: 5ºC txog 35 ℃
(2) NTAUB NTAWV TSIS TXAUS SIAB: 45% txog 85%
(3) Kev kub siab: 86Kpa txog 106Kpa
SOLDERA BILITY TEST: Sab saum toj ntawm lub terminals yuav tsum tau dipped 1 hli nyob rau hauv lub SOLDER da dej ntawm 250 ± 5 ℃ rau 5 ± 0.5 vib nas this
RESISTANCE TO SOLDERING HEAT TEST:
REFLOW SOLDERING CONDITIONS:
PREHEAT: Kub ntawm cov tooj liab FOIL Surface yuav tsum ncav cuag 180 .120 ℃ S tom qab lub PCB nkag mus rau hauv cov khoom siv Soldering.
TALLEST TEMPERATURE: Kub ntawm qhov tooj liab FOIL Surface yuav tsum ncav cuag qhov siab tshaj plaws kub ntawm 260 ± 5 nrog rau hauv 20 vib nas this.℃
SOLDERING IRON METHOD: IB TUG MENYUAM 330 ± 5 ℃ APPLICATION SIJHAWM SOLDERING IRON 3 ± 0.5 SEC Txawm li cas los xij, kev kub siab tshaj yuav tsis siv rau lub terminal